产品规格书/Specification
产品/product: | 发热浆料 Heating paste |
料号/Part number: | XJY081 |
适用范围/Application:
本电阻浆料适合用于厚膜电路、陶瓷基材等基材,本材料可印刷,涂抹施工,有着低烧结温度,成本低等产品特性,是用于后模发热产品的理想材料。
使用条件/Operating conditions:
基材 Substrate | 氧化铝、陶瓷,玻璃等基材 Alumina ceramic, glass |
印刷 Printing | 100-150目丝网印刷 100-150 mesh stainless screen |
流平 Levelling | 5-15min minutes at room temperature 室温下流平5-15分钟(时间根据流平的实际情况决定)。 |
干燥 Drying | 通风烘箱烘烤100-150℃,10-15分钟(烘烤温度低于230℃) 100-150℃,10-15 min |
烧结 Firing Condition | 隧道炉空气下烧结,峰值600~650℃(推荐值),峰值10分钟。 Tunnel furnace sintering atmosphere, the peak of600~650℃ (recommended), at peak of10minutes. |
稀释剂 Thinner | STY1 |
2.烧结后特性/Characteristics after firing:
在1烧结条件下,膜厚8-12mm Check fired film produced under the conditions specified in 1), (Film thickness is 8-12mm.)
Characteristic | Standard | Test method and conditions | |
1 | Fineness | ≤8μm | FOG test |
2 | Viscosity | 100-200Pa.s | Brookfeild HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1℃ |
3 | Appearance | Black | Eyeballing |
4 | 方阻值 | 80欧姆 | 可通过丝网目数和印刷厚度来实现不同的方阻值 |
保存条件,有效期/Storage condition and Term of validity
产品应在5-25℃的环境温度下密封储存,有效期为产品发货之日起六个月。
包装方式/Packaging method:
1000g/罐, 1000g/can
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